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|---|---|---|---|---|---|---|
| Current-carrying punched part | Copper E-Cu | CW004A | Follow-up network | blank | Power line | ISO 9001 |
| Contact punched part | Cu-OFE | CW009A | Precision punching | silver-plated | Contacting | REACH |
| Mechanical copper part | CuZn30 | CW505L | Punching | tinned | Connection | RoHS |
| Spring contact stamped part | CuSn6 | CW452K | Fine blanking | blank | Contact spring | ISO 9001 |
| Parameter | Typical industrial characteristics |
|---|---|
| Material | Cu-ETP (CW004A), Cu-OFE (CW008A), CuNiSi, CuSn |
| Thickness range | 0.2 - 1.5 mm (depending on contact/spring) |
| Functional areas | flat / embossed / polished locally possible |
| Coating | Sn, Ni, Ag, Au (local or full surface) |
| Edge requirement | Defined burr position / deburred depending on contact zone |
| Process logic | Strip goods, progressive die, reel-to-reel if necessary |
| Parameter | Typical industrial characteristics |
|---|---|
| Material | Cu-ETP (CW004A), Cu-DHP (CW024A) |
| Thickness range | 1,0 - 3,0 mm |
| Hole/slot geometries | relevant for assembly and creepage distance |
| Flatness | Function-dependent (contact pad/insulation package) |
| Surface | blank, tin-plated, nickel-plated (corrosion/contact requirement) |
| Additional operations | Countersinking, embossing, thread forming (depending on application) |
| Parameter | Typical industrial characteristics |
|---|---|
| Material | CuSn, CuNiSi, Cu-ETP (adapted to degree of deformation) |
| Thickness range | 0,3 - 2,5 mm |
| Bending design | Dependent on material and direction (crack/crease prevention) |
| Angle tolerance | depending on process and geometry |
| Springback | clearly relevant for Cu alloys |
| Tool concept | Progressive system with bending stations |
| Parameter | Typical industrial characteristics |
|---|---|
| Material | Cu-ETP, CuSn, CuNiSi |
| Thickness range | 0,2 - 2,0 mm |
| Embossing geometry | position- and height-critical (contact/distance/stiffness) |
| Surface requirement | Functional area-related (e.g. contact points) |
| Process window | force- and wear-critical for larger embossing surfaces |
| Test characteristic | Embossing height / position / repeatability |
| Parameter | Typical industrial characteristics |
|---|---|
| Material | Cu-ETP, CuSn |
| Thickness range | 0,2 - 0,8 mm |
| Critical geometries | Web widths, radii, hole spacing (design-determining) |
| Edge status | Low burr/defined burr position depending on function |
| Process management | Belt punching, high stroke rates, tight tool clearance |
| Quality inspection | Optics/2D measurement, position-related feature check |
| Parameter | Typical industrial characteristics |
|---|---|
| Structure | Cu layer(s) + insulation layer (e.g. foil/pressed material, depending on application) |
| Total thickness | 0.6 - 3.0 mm (depending on package) |
| Insulation requirement | Voltage- and environment-dependent |
| Edge requirement | Exposed ladder edges vs. insulated edge zones |
| Positioning | Registration/reference hole systems relevant |
| Application | Power modules, battery connection, compact power distribution |